Coefficient of Thermal Expansion Balancing for Field Assisted Bonding of Silicon to Glass
Abstract
Stresses caused by thermal expansion coefficients mismatch of anodically bonded glass and silicon samples are studied. An analytical model to determine graphically the optimum bonding temperature is presented. It is essentially a model for thin-film stress but uses integration of the linear coefficient of thermal expansion difference between the bonding temperature and the working temperature. Recommendations for choosing the bonding temperature of silicon to two brands of glass (Corning 7740 and LK5) are made. Keywords: anodic bonding, field assisted bonding, thermal expansion, stress.
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