Insight into Potential Well Based Nanoscale FDSOI MOSFET Using Doped Silicon Tubs- A Simulation and Device Physics Based Study: Part II: Scalability to 10 nm Gate Length

Abstract

The doped silicon regions (tubs) in PWFDSOI MOSFET cause significant reduction in OFF current by reducing the number of carriers contributing to the OFF current. The emphasis of the simulation and device physics study on PWFDSOI MOSFET presented in this paper is on the scalability of the device to 10 nm gate length and its related information. A high ION /IOFF ratio of 7.6 x 10^5 and subthreshold swing of 87 mV/decade were achieved in 10 nm gate length PWFDSOI MOSFET. The study was performed on devices with unstrained silicon channel.