Numerical Analysis of Liquid Cooling of 3D-ICs Using Embedded Channels

Abstract

Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using embedded channels, liquid cooling systems can be designed to deliver the right amount of coolant to each spot of the chip. In this study, numerical analysis is used to investigate the cooling of a 20 W hot spot using embedded channels employing three coolants: water, Freon (R22), and liquid nitrogen (LN). The investigation of thermal management and stress show that, although LN provides the lowest operating temperature (164 K), it causes the highest stress (355 MPa) at 100 mm/s inlet velocity. The study also shows that, coolant delivery using parallel channels results in a wide variation of local temperatures and stress. This stress variation may form high-stress spots, which may cause circuit failure, performance degradation, or yield reduction. Therefore, cooling systems and chip fabrication should be designed to ensure the elimination of high-stress hot spots.