In-situ MOCVD Growth and Band Offsets of Al2O3 Dielectric on β-Ga2O3 and β-(AlxGa1-x)2O3 thin films

Abstract

The in-situ metalorganic chemical vapor deposition (MOCVD) growth of Al2O3 dielectrics on β-Ga2O3 and β-(AlxGa1-x)2O3 films is investigated as a function of crystal orientations and Al compositions of β-(AlxGa1-x)2O3 films. The interface and film qualities of Al2O3 dielectrics are evaluated by high resolution X-ray diffraction (HR-XRD) and scanning transmission electron microscopy (HR-STEM) imaging, which indicate the growth of high quality amorphous Al2O3 dielectrics with abrupt interfaces on (010), (100) and (-201) oriented β-(AlxGa1-x)2O3 films. The surface stoichiometries of Al2O3 deposited on all orientations of β-(AlxGa1-x)2O3 are found to be well maintained with a bandgap energy of 6.91 eV as evaluated by high resolution x-ray photoelectron spectroscopy, which is consistent with the atomic layer deposited (ALD) Al2O3 dielectrics. The evolution of band offsets at both in-situ MOCVD and ex-situ ALD deposited Al2O3/β-(AlxGa1-x)2O3 are determined as a function of Al composition, indicating the influence of the deposition method, orientation, and Al composition of β-(AlxGa1-x)2O3 films on resulting band alignments. Type II band alignments are determined at the MOCVD grown Al2O3/β-(AlxGa1-x)2O3 interfaces for (010) and (100) orientations, whereas type I band alignments with relatively lower conduction band offsets are observed along (-201) orientation. Results from this work revealed that the in-situ MOCVD deposited high quality Al2O3 dielectrics with sharp interfaces can be considered as a viable alternative of commonly used ex-situ deposited (ALD) Al2O3 for developing high performance β-Ga2O3 and β-(AlxGa1-x)2O3 based devices.

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