A residual stress characterization method of a small diameter wire by matter removal

Abstract

Standard spring design is based on the assumption that there is no residual stress in the wire. This assumption can be quite strong for small wires that undergo a significant wire drawing during the manufacturing process. The main objective of this work is to design and test a method for characterizing residual stresses in small diameter drawn wires. The basic principle consists in removing a part of the material and then measuring the associated displacements. This material removal was simulated by finite elements and experimented in real situation. The first results are encouraging because they seem to show that the residual stresses in the wire studied are significant, and justify our investigations.