Enlargement of Memory Window of Si Channel FeFET by Inserting Al2O3 Interlayer on Ferroelectric Hf0.5Zr0.5O2

Abstract

In this work, we demonstrate the enlargement of the memory window of Si channel FeFET with ferroelectric Hf0.5Zr0.5O2 by gate-side dielectric interlayer engineering. By inserting an Al2O3 dielectric interlayer between TiN gate metal and ferroelectric Hf0.5Zr0.5O2, we achieve a memory window of 3.2 V with endurance of ~105 cycles and retention over 10 years. The physical origin of memory window enlargement is clarified to be charge trapping at the Al2O3/Hf0.5Zr0.5O2 interface, which has an opposite charge polarity to the trapped charges at the Hf0.5Zr0.5O2/SiOx interface.