Evaporative cooling and deposition patterns of evaporating Al2O3 nanofluid droplets

Abstract

The present study examines evaporative cooling and the resulting deposition patterns of a sessile Al2O3-based nanofluid droplet on a hydrophobic glass substrate at different temperatures. Evaporation predominantly occurs in the pinned contact line mode for both heated and non-heated cases, with only slight recession observed without heating. The droplet height and contact angle decrease linearly with time, and scaling relations are proposed to describe the evolution of droplet geometry and volume. A non-dimensional parameter, rel, is introduced to characterize transitions in deposition patterns. For rel ≤ 1 (Ts ≤ 26), interconnected irregular polygonal network structures form at the periphery, which are rarely reported in evaporating droplets. With increasing substrate temperature, this structure is suppressed, giving rise to a classical coffee-ring pattern for 1 < rel ≤ 10. At higher temperatures (Ts > 40), dual-ring formation along with central particle deposition is observed for rel > 10. The interfacial temperature is higher near the contact line and decreases toward the apex, and a universal scaling for the temperature profile is proposed. Internal flow velocity increases with substrate temperature, exhibiting asymmetric multi-vortex structures. Evaporative cooling intensifies with heating, enhancing evaporation flux and capillary flow. Appropriate scaling relations for evaporation flux and capillary velocity are established. Overall, the dynamics are governed by thermocapillary (Marangoni) flow induced by evaporative cooling, which enhances internal circulation and governs nanoparticle deposition morphology.

0

Turn this paper into a full lesson

ArcXiv compiles a staged curriculum from this paper: 8-12 lessons across beginner → advanced, synthesised section guides, visuals, flashcards, a quiz, exercises, and on-demand deep dives per section. Grounded in the abstract, never invented.

Discussion (0)

Sign in to join the discussion.

Loading comments…