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Experimental Persistence Probability for Fluctuating Steps

D. B. Dougherty, I. Lyubinetsky, E. D. Williams, M. Constantin, C. Dasgupta, S. Das Sarma

cond-mat.stat-mecharXiv:cond-mat/0209068

Abstract

The persistence behavior for fluctuating steps on the Si(111) (3 × 3)R300 - Al surface was determined by analyzing time-dependent STM images for temperatures between 770 and 970K. The measured persistence probability follows a power law decay with an exponent of θ=0.77 0.03. This is consistent with the value of θ= 3/4 predicted for attachment/detachment limited step kinetics. If the persistence analysis is carried out in terms of return to a fixed reference position, the measured persistence probability decays exponentially. Numerical studies of the Langevin equation used to model step motion corroborate the experimental observations.

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