Analytical solutions for the interstitial diffusion of impurity atoms
O. I. Velichko, N. A. Sobolevskaya
Abstract
The analytical solutions of the equations describing impurity diffusion due to migration of nonequilibrium impurity interstitials were obtained for the impurity redistribution during ion implantation at elevated temperatures and for diffusion from a doped epitaxial layer. The reflecting boundary condition at the surface of a semiconductor and the conditions of constant concentrations at the surface and in the bulk of it were used in the first and second cases, respectively. On the basis of these solutions hydrogen diffusion in silicon during high-fluence low-energy deuterium implantation and beryllium diffusion from a doped epi-layer during rapid thermal annealing of InP/InGaAs heterostructures were investigated. The calculated impurity concentration profiles agree well with experimental data. The fitting to the experimental profiles allowed us to derive the values of the parameters that describe interstitial impurity diffusion.
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