Consideration of arrayed $e$-beam microcolumn based systems potentialities for wafer defects inspection

Abstract

The $e$-beam column which is intended on defects inspection is considered. The defects which are to be examined or potentially might be examined at inspection stage are briefly considered. Interrelations between the system parameters is ascertaining and the ways of optimization and the technical requirements to the system in whole are discussed. As a result, we find the optimal combinations of the system parameters for the purpose.