First results of the new endcap TOF commissioning at BESIII
Abstract
The upgrade of the current BESIII Endcap TOF (ETOF) is carried out with the Multi-gap Resistive Plate Chamber (MRPC) technology. The installation of the new ETOF has been finished in October 2015. The first results of the MRPCs commissioning at BESIII are reported in this paper.
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