A multi-channel silicon package for large-scale skipper-CCD experiments

Abstract

The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present the design, fabrication, testing, and empirical signal model of a multi-channel silicon package. In addition, we outline the chosen specifications for the ongoing production of 1500 wafers that will add up to a 10 kg skipper-CCD array with 24000 readout channels.