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Scandium diboride: a semi-metallic, lattice, thermally matched substrate for vertical AlGaN power electronics

MVS Chandrashekhar, Daniel Joel Harrison, Ahamed Raihan, Astrid D. Kengne, R. Shipra, Han Xie, Tasnia Jabin, Monte Hendrix, Ethan Scott, Roshan S. Annam, Sharad Mahatara, Evan N. Crites, Allana G. Iwanicki, Luke J. Meiler, Maxime Siegler, Renae N. Gannon, Steven R Spurgeon, Ashutosh Giri, Rajeswari Kolagani, Joshua A. Burrow, Stephan Lany, Patrick Hopkins, Tyrel M. McQueen, Michael Spencer, Satya Khushwaha

cond-mat.mtrl-sciarXiv:2609.24856

Abstract

We report the properties of hexagonal (space group P6/mmm) scandium diboride (ScB2) single crystals grown by a laser diode floating zone method at growth rates of ~1mm/hr under B-rich conditions with (002) rocking curve widths Δω=38'' approaching the quality of commercial SiC/GaN substrates. Lattice expansion measurements reveal matching to Al0.55Ga0.45N with a coefficient of thermal expansion ~5ppm/K at typical AlGaN growth temperatures, enabling thick AlGaN layers for ultra-wide bandgap (UWBG) power electronics >1kV. We measure semi-metallic room temperature resistivity ~15μΩ cm, climbing to ~93μΩ cm at 773K with a T2 dependence effectively eliminating substrate parasitic resistance, the limiting factor in exploiting the full potential of UWBG. The Debye temperature θD,ScB2 from heat capacity and lattice expansion is ~850K well matched to θD,ScB2, but lower than the 1100K measured for Sc-rich growth conditions. We discuss Debye matching as a key substrate codesign criterion providing significant overlap in phonon modes for heat removal and thermal matching during AlGaN growth. The competitive thermal conductivity at room temperature 53W/mK is half that from full first principles calculations, a discrepancy we attribute to the presence of Sc-vacancies generated by B-rich growth. while the resistivity is ~2x the theoretical value, indicating that both electrons and phonons play equal role in thermal transport. The smooth ~2.5nm rms roughness surface enables advanced heat removal modalities through engineered phonon bridges and phonon polaritons in ScB2/AlGaN interfacial heterostructures, potentially allowing ~10-100x increase in power handling over state-of-the-art GaN/SiC.

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