Design optimization of the inter-electrode structures in DC-RSD
N. Cartiglia, R. Arcidiacono, G. Bardelli, M. Boscardin, A. Cassese, M. Centis Vignali, T. Croci, M. Durando, M. Ferrero, A. Fondacci, S. Gaiero, O. Hammad Ali, L. Lanteri, A. Losana, L. Menzio, A. Morozzi, F. Moscatelli, D. Passeri, G. Paternoster, G. Sguazzoni, F. Siviero, V. Sola, L. Viliani
Abstract
DC-coupled Resistive Silicon Detectors (RSD) share charge among electrodes through a resistive n+ surface layer, and the choice of inter-electrode structure --- a trench, a resistive strip, or no structure at all --- directly determines the achievable position resolution and its uniformity. This paper addresses the question of which structure best optimises the spatial resolution. To answer it quantitatively, DCRSDSurfaceSimulator was developed, a ROOT-based tool that models the resistive surface as a two-dimensional Kirchhoff resistive network and solves for charge sharing as a function of hit position, surface resistivity, and inter-electrode structure. The simulator is validated against test-beam data from FBK DC-RSD sensors with 300, 500, and 1000~μm pixel pitch, reproducing the position resolution, its spatial uniformity, and the signal-sharing templates correctly. Using the validated simulator, trenches, resistive strips, and no containment are then compared on position resolution and its spatial uniformity, inter-electrode resistance, and signal leakage to outer pixels. Resistive strips are found to outperform trenches in resolution by approximately 25\% for all tested strip resistances (500--2000~Ω) and input impedances (0--100~Ω), at a surface resistivity of 1000~Ω/, and trace the origin of this difference to the spatial gradient of the charge-sharing fraction: trenches produce a markedly weaker and less uniform gradient, particularly away from the pixel centre, than either a resistive strip or a bare resistive surface.
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