Fabrication of Ag/Tl-Ba-Ca-CuO/CdSe nanostructure by electrodeposition technique
P. M. Shirage, D. D. Shivagan, L. A. Ekal, N. V. Desai, S. B. Mane, S. H. Pawar
Abstract
Junction between metal, superconductor and semiconductor materials seems to be promising for their applications as the electronic devices, microelectronic devices and high power transmission. E-mail shpawarphy@unishivaji.ac.in.
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