Modeling of the Peeling Process of Pressure-sensitive Adhesive Tapes with the Combination of Maxwell Elements
Katsuhiko Sato, Akihiko Toda
Abstract
A simple model for the peeling process of pressure-sensitive adhesive tape is presented. The model consists of linear springs and dashpots and can be solved analytically. Based on the modeling, the curved profile of the peeling tape is spontaneously determined in terms of viscoelastic properties of adhesives. Using this model, two experimental results are discussed: critical peel rates in the peel force and the peel rate dependence of the detachment process of adhesive from the substrate.
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