Characterization of a fabrication process for the integration of superconducting qubits and RSFQ circuits
Maria Gabriella Castellano, Leif Gronberg, Pasquale Carelli, Fabio Chiarello, Carlo Cosmelli, Roberto Leoni, Stefano Poletto, Guido Torrioli, Juha Hassel, Panu Helisto
Abstract
In order to integrate superconducting qubits with rapid-single-flux-quantum (RSFQ) control circuitry, it is necessary to develop a fabrication process that fulfills at the same time the requirements of both elements: low critical current density, very low operating temperature (tens of milliKelvin) and reduced dissipation on the qubit side; high operation frequency, large stability margins, low dissipated power on the RSFQ side. For this purpose, VTT has developed a fabrication process based on Nb trilayer technology, which allows the on-chip integration of superconducting qubits and RSFQ circuits even at very low temperature. Here we present the characterization (at 4.2 K) of the process from the point of view of the Josephson devices and show that they are suitable to build integrated superconducting qubits.
Create a lesson
Related papers
Ta-based S-I-S junctions for integrated superconducting Electronics
Trent Borman, Cameron Bullock, Cole Chason et al.
Nonreciprocal charge transport in quantum materials: From superconductors to magnetic systems
Boning Yu, Yalei Huang, Alltrin Dhanarajagopal et al.
Intra-unit-cell Josephson scanning tunneling spectroscopy of the cuprate Bi1.2Pb0.8Sr2CaCu2O8+δ
Fengyu Yao, Jiong Mei, Wenjin Mao et al.
Constraining the Superconducting Gap of Monolayer FeSe/SrTiO3 via Statistical Analysis and Tip-Height-Dependent Tunneling Spectroscopy
Dongwon Shin, Xiyou Peng, Kaleb McClure et al.
Acoustic damping limits superfluid helium as a thermal bath for mechanical resonators
Yunhu Huang, Mehri Ebrahimi, Alireza Rashedi et al.
Superinsulation, electric confinement in condensed matter
M. Cristina Diamantini, Carlo A. Trugenberger