Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
H. B. Yao, M. Bouville, D. Z. Chi, H. P. Sun, X. Q. Pan, D. J. Srolovitz, D. Mangelinck
Abstract
Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.
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