The challenge of hybridization

Abstract

Hybridization of pixel detector systems has to satisfy tight requirements: high yield, long term reliability, mechanical stability, thermal compliance and robustness have to go together with low passive mass added to the system, radiation hardness, flexibility in the technology end eventually low cost. The current technologies for the interconnection of the front-end chips and the sensor are reviewed and compared, together with the solutions for the interface to the far-end electronics.