Application of Ultraviolet Fluorescence in Wafer Surface Cleaning Analysis
Abstract
Ultraviolet fluorescence (UVF) is introduced as a novel and versatile method for the determination of the contamination of metal impurities on silicon wafer surfaces. The results given demonstrate the usefulness of UVF for contamination control in silicon wafer processing. The experiments show some main characteristic peaks such as Fe, Cu, Ni and Na at room temperature. Compared with other surface sensitive techniques, the main advantages of UVF are low detection limits, simultaneous multi-element analysis and high sensitivity (up to 109 Fe/cm2).
Turn this paper into a full lesson
ArcXiv compiles a staged curriculum from this paper: 8-12 lessons across beginner → advanced, synthesised section guides, visuals, flashcards, a quiz, exercises, and on-demand deep dives per section. Grounded in the abstract, never invented.