The RD50-MPW4: A Radiation Hard HV CMOS Sensor for Future Colliders

Abstract

The former CERN RD50 collaboration develops monolithic active pixel high voltage (HV) CMOS sensors for future colliders with the aim of high radiation tolerance, good time resolution, and high granularity pixel detectors. The most recent prototype, the RD50-MPW4, was produced by LFoundry in December 2023 using a 150 nm CMOS process. It features a matrix of 64x64 pixels with a 62 $μ$m pitch and employs a column-drain readout architecture. Compared to its predecessor, it now has separate analog and digital power domains and a new biasing scheme with a guard ring structure that supports bias voltages over 600 V. This contribution will discuss the design and latest results of the MPW4, where tests with unirradiated samples showed more than 99.9% efficiency, 16 $μ$m spatial resolution and 10 ns timing resolution. Efficiencies of over 99% were achieved for samples irradiated to fluences of $1 \times 10^{15}$ 1 MeV n$_{\mathrm{eq}}/\mathrm{cm}^2$. A 3D map of the charge collection efficiency from a measurement with two-photon absorption laser is presented that nicely outlines the depletion depth of this radiation hard, high granularity monolithic active pixel sensor.